Carrier Solutions

Corning provides high precision glass carriers for temporary bonding in advanced semiconductor packaging processes such as silicon wafer thinning and fan-out level processing. Our ultra-flat glass carriers have superior surface quality, thickness, and edge strength, making them the substrate of choice for advanced packaging.

Corning's glass carriers are available in a wide range of CTEs to meet customers’ most challenging requirements – from research & development phase to mass production. We have an established global supply chain and have shipped hundreds of thousands of wafers to top-tier customers already.

Learn more about Corning Carrier Solutions below, including our two product categories: Standard Glass carriers and Advanced Packaging Carriers.

 

Product Information

PGS Carrier Wafers

Standard Glass Carriers

Standard Glass Carriers

Ultra-flat glass carriers available in CTEs from 3.4 - 9.5

Ultra-flat glass carriers available in CTEs from 3.4 - 9.5

PGS Carrier Wafer Flatness

Advanced Packaging Carriers

Advanced Packaging Carriers

Ultra-flat glass carriers designed to reduce customers' in-process warp by up to 40%. Rapid sampling enabled by Corning's Agile Manufacturing Platform.

Ultra-flat glass carriers designed to reduce customers' in-process warp by up to 40%. Rapid sampling enabled by Corning's Agile Manufacturing Platform.

Ultra-Low TTV Glass Carrier Wafers

Ultra-Low TTV Glass Carrier Wafers

This glass wafer has one of the lowest TTV currently available and enables advanced semiconductor manufacturing as well as RF applications for 5G connectivity and hybrid bonding.

This glass wafer has one of the lowest TTV currently available and enables advanced semiconductor manufacturing as well as RF applications for 5G connectivity and hybrid bonding.

Resources

Resources

Application Services Brochure

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In The News

Corning wins 2019 Supplier of the Year Award for Advanced Packaging Carriers

Corning wins 2019 Supplier of the Year Award for Advanced Packaging Carriers

25-Jun-2019

Corning won the 2019 3D InCites’ Award, which was developed especially to address in-process warp issues for high-density FO packaging. This is the first time a glass manufacturer has received the award.

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Precision Glass Solutions Introduces Advanced Packaging Carriers Optimized for Fan-Out Processes

Precision Glass Solutions Introduces Advanced Packaging Carriers Optimized for Fan-Out Processes

21-Jan-2019

Corning Incorporated (NYSE: GLW) introduced its latest breakthrough in glass substrates for the semiconductor industry, Advanced Packaging Carriers.

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